This DL-A6601PA-B wireless transceiver module is a high-power RF module based on the ASR6601 chip solution with LoRa modulation, which integrates a 48MHz main frequency Cortex-M4 low-power core. While this ASR6601 SOC chip is an MCU with RF encapsulated, with higher integration than the SPI+MCU solution, but smaller size.

DL-CC2340-A and DL-CC2340-B BLE modules are both designed base on TI's SimpleLink™ wireless series CC2340R5 Bluetooth® Low Energy Chip, which uses a 48-MHz Cortex-M0+ kernel, integrates up to 512 KB of flash memory, 36 KB of SRAM,and has up to 26 universal I/O interfaces. Moreover, these Bluetooth Low Energy modules are equipped with a built-in 48MHz 10PPM external high-speed clock, and 32.768Khz external low-speed clock.

DL-PAN3029-S is a wireless module designed based on PANCHIP’s radio frequency chip PAN3029.The power supply of this module adopts a chip integrated DCDC working mode, which can greatly reduce power consumption in various modes. It is equipped with a built-in temperature compensation crystal, which can effectively reduce temperature drift and ensuring more stable transmission.

The 868/915Mhz RFM95 Wireless Transceiver Moduless feature the LoRa long range modem that provides ultra-long range spread spectrum communication and high interference immunity whilst minimising current consumption.

DL-CC1310-B Wireless Module is a SoC Transceiver Module (UART Module) with AT command, which was developed based on Texas Instruments' CC1310F128RHBR RF chip. It combines an integrated RF Controller (Cortex®-MO) and a powerful Arm® Cortex®-M3 Processor, which is ideal to use especially for battery power IoT applications.

This DL-CC1310-B Wireless Module supports Narrow-band Communication, Direct Sequence Spread Spectrum (DSSS), Long-range Transmission and High-efficiency Communication. Its fully functional AT Commands support any Serial Baud Rate setting from 1920bps to 256000bps, which can greatly improve the communication efficiency with up to -124dBm receiver sensitivity.