High-Power BLE Mesh SoC Based Wireless Module (TLSR8250F512 & PA)
Product Description
High-Power BLE Mesh SoC Wireless Module (with TELINK TLSR8250F512 and PA)
DL-TL8250PA-A is a BLE Module designed base on the Telink BLE SoC TLSR8250F512 wireless transceiver chip, featuring BLE and SIG Mesh capabilities. This wireless module integrates a built-in PA and LNA, with a transmit power of +20dBm and a sensitivity of -98 dBm at 1 Mbps. RF matching is fully integrated into the module, and the antenna operates at 50Ω with an external IPEX or SMA RF connector. Users do not need in-depth knowledge of RF circuit design to achieve optimal performance.
Its software integrates SIG Mesh transparent transmission functionality, enabling communication via UART. With this module, users can easily develop wireless products with stable performance and high reliability, significantly shortening the product development cycle.
Chip Resources
● 32-bit MCU, up to 48MHz operating speed, with efficiency comparable to ARM M0
● 48kB SRAM, 512kB internal Flash
● 17 GPIOs, Peripherals: UART, SPI, I2C, PWM, 14-bit ADC
● BLE / 2.4GHz Radio
Features
● Operating Frequency Band: 2.38 GHz ~ 2.5 GHz
● SIG MESH Operating Frequency Band: 2.402 ~ 2.480 GHz
GATT Proxy: 2404 ~ 2478 MHz (BLE CH 0 ~ 36)
MESH: 2402 / 2462 / 2480 MHz (BLE CH 37, 38, 39)
● Operating Voltage: 3.3 V
● Maximum Output Transmit Power: +20 dBm
● Receive Current: 16 mA
● Sleep Current: 2 µA
Download Center
Datasheet of DL-TL8250PA-A Wireless Module V1.0
Technical Parameter
Parameter | Min. | Typical | Max. | Unit | Remark |
Operating Conditions | |||||
Working Voltage (VDD) | 2.0 | 3.3 | 3.6 | V | Unable to output Max. power when the voltage is below 3.0V; The built-in PA cannot operate normally when the voltage is below 2.0V |
Communication Level | -0.3 | 3.3 | VDD +0.2 | V | Exceeding this range may damage the RF chip |
Working Temperature | -40 | 25 | 85 | ℃ | The larger the temperature difference, the greater the required bandwidth |
Current Consumption | |||||
RX Current | 14 | 16 | 18 | mA | @DCDC |
TX Current | 91 30 20 | 110 39 30 | 120 52 35 | mA | @2401MHz @DCDC ANT 50Ω; TX Power @ +20dBm ANT 50Ω; TX Power @ +13dBm ANT 50Ω; TX Power @ 0dBm |
Sleep Current | 1 | 2 | 10 | uA | MCU power-down, software at minimum current. |
RF Parameters | |||||
Transmission Power Range | -10 | 20 | 22 | dBm | The internal configuration power must not exceed 5dBm, otherwise it will be burned out |
Sensitivity | -98 -104 | dBm dBm | @1Mbps, MESH defaulted @250Kbps reference, MESH does not support | ||
Pins Definition:
NO. | Pin Name | Type | Pin Description |
1 | VDD | PWR | To ensure maximum chip performance, a stable voltage (≥3.0V) is required |
2 | GND | PWR | Reliable grounding, power return path |
3 | PD7_UART_TX | O | The MESH program is defined as UART_TX and requires an external RXD |
4 | PA0_UART_RX | I | The MESH program is defined as UARD_RX and requires an external TXD |
5 | PA7 | I/O | SWS module program download port, 3.3V SWS GND can be burned with three pins |
6 | PB1 | I/O | Normal I/O port, currently without function |
7 | PB4 | I/O | Normal I/O port, currently without function |
8 | PB5 | I/O | Normal I/O port, currently without function |
9 | PB6 | O | The MESH program is defined as AUX, used to indicate the MESH status |
10 | PB7 | I | The MESH program is defined as MODE, which is used to control the state of MESH |
11 | PC0 | I/O | Normal I/O port, currently without function |
12 | PC1 | I/O | Normal I/O port, currently without function |
13 | PC2 | O | The MESH program is defined as a SIG standard model output. During testing, it is recommended to bring out an LED for APP debugging and testing. |
14 | PC3 | O | The MESH program is defined as a SIG standard model output. During testing, it is recommended to bring out an LED for APP debugging and testing. |
15 | PC4 | I/O | Normal I/O port, currently without function |
16 | RESET | I | Chip reset pin, low level reset; N/C and high level for normal operation |
17 | PD2 | I/O | Normal I/O port, currently without function |
18 | PD3 | I/O | Normal I/O port, currently without function |
19 | GND | A | Reliable grounding, ANT return path, ensuring the shortest path |
20 | ANT | AI/AO | RF signal input/output port, π-matching circuit must be reserved; Adopt 50Ω impedance matching for RF routing, route the ground and add via holes around it |
Product size:
In conclusion, this DL-TL8250PA-A is a high-power Bluetooth Mesh wireless module based on the Telink TLSR8250F512 BLE SoC, featuring an integrated PA and LNA with +20 dBm transmit power and -98 dBm sensitivity at 1 Mbps. It supports BLE and SIG Mesh with transparent transmission over UART, offers 17 GPIOs and multiple peripherals (UART, SPI, I2C, PWM, 14-bit ADC), and operates at 3.3 V with low power consumption (16 mA RX, 2 µA sleep). RF matching is fully integrated with a 50 Ω external IPEX/SMA antenna interface, enabling easy development of reliable wireless products for smart home, lighting, building automation, sensor networks, and IoT applications.
DreamLNK is a high-tech enterprise specializing in ISM band micropower wireless communication technology, providing different kinds of wireless modules and one-stop IoT solutions, including 433/868/915MHz wireless modules, 2.4G wireless Modules, FSK Transceiver Modules, LoRa Modules, BLE Modules, Antennas, Remote Controls, and customized wireless RF solutions. Welcome to inquire!