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DL-TL8250-A
DreamLNK
DL-TL8250-A
Bluetooth 5.0
TLSR8250F512
10dBm
1.8~3.6V
-104dBm
200m
12x18.71mm
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BLE Mesh SoC Based Wireless Module with TELINK TLSR8250F512
The DL-TL8250-A Bluetooth module is a high-performance Bluetooth 5.0 SoC module developed by DreamLNK based on the TLSR8250F512 chip. It features BLE and SIG MESH capabilities, with a transmit power of 10 dBm and a sensitivity of up to -104 dBm @ 250 kbps. It delivers fast operation with an integrated 48 KB SRAM for high processing efficiency, and a low-power 32-bit processor running at 48 MHz with 512 KB of large-capacity Flash storage, making it well-suited for complex application scenarios. This Bluetooth module supports Bluetooth mesh networking and direct control via Tmall Genie. Devices communicate through a SIG Mesh multi-hop star topology using Bluetooth broadcasting, and the mesh network can be flexibly expanded to cover larger areas.
The module meets the requirements for low power consumption, low latency, and short-range wireless data communication, offering enhanced, stable, flexible, and reliable connectivity for applications in smart lighting, IoT for electrical systems, smart homes, smart cities, and consumer electronics. It supports standard and industry alliance specifications, including Bluetooth Low Energy (Bluetooth 5.0), BLE Mesh, 6LoWPAN, ZigBee, RF4CE, HomeKit, ANT, and 2.4 GHz proprietary protocols.
The module software features a highly integrated design with a built-in complete SIG Mesh protocol stack and serial transparent transmission firmware. Customers can quickly implement mesh networking, data forwarding, and device control via a UART serial interface, without the need for in-depth development of the Bluetooth underlying protocol. This significantly reduces R&D investment and shortens development cycles.
RF Characteristics
· Supports Bluetooth 5.0 and BLE Mesh
· Supported data rates: BLE 1 Mbps / 2 Mbps, Long-Range modes 125 kbps / 500 kbps, compatible with Tmall Genie Mesh
· Receive sensitivity: -104 dBm @ 250 kbps, -98 dBm @ 1 Mbps
· Transmit power: Up to +10 dBm, with multi-step adjustability
· Bluetooth 5.0 open-field transmission distance up to 100 meters
· RSSI: Monitoring accuracy ±1 dB
· Large-capacity Flash storage: 512 KB Flash memory, providing ample storage space
· High-speed built-in SRAM: 48 KB on-chip SRAM for accelerated data caching and access
· High-precision ADC: On-board 14-bit high-precision ADC for accurate acquisition and conversion of analog signals
· Supports UART / GPIO / I2C / PWM / ADC / SPI interfaces
· Supply voltage range: 1.8–3.6 V, with 3.3 V recommended
· Supports AT command configuration and UART serial firmware, as well as secondary development
· Built-in 4-byte globally unique chip ID (UID)
· Three general-purpose 32-bit timers supporting 4 operating modes; built-in watchdog timer and 32 kHz low-power timer
· Hardware encryption: Built-in hardware AES-CCM and ECC elliptic curve encryption engines
· Integrated BLE and Tmall Genie Mesh protocols, no external co-processor required
Download Center
Datasheet of DL-TL8250-A Wireless Module V1.0 
Technical Parameter
Parameter | Min. | Typical | Max. | Unit | Remark |
Operating Conditions | |||||
Working Voltage (VDD) | 1.8 | 3.3 | 3.6 | V | Unable to output Max. power when the voltage is below 3.0V; |
Communication Level | -0.3 | 3.3 | VDD +0.2 | V | Exceeding this range may damage the RF chip |
Working Temperature | -40 | 25 | 85 | ℃ | The larger the temperature difference, the greater the required bandwidth |
Current Consumption | |||||
RX Current | 14 | 16 | 18 | mA | @DCDC |
TX Current | 21 4 | 23 5 | 25 7 | mA | @2401MHz @DCDC ANT 50Ω; TX Power @ +10dBm ANT 50Ω; TX Power @ 0dBm |
Sleep Current | 1 | 2 | 10 | uA | MCU power-down, software at minimum current. |
RF Parameters | |||||
Transmission Power Range | -10 | 10 | 10 | dBm | The internal configuration power must not exceed 5dBm, otherwise it will be burned out |
Sensitivity | -98 -104 | dBm dBm | @1Mbps, MESH defaulted @250Kbps reference, MESH does not support | ||
Pins Definition:
NO. | Pin Name | Pin Description |
1 | PD2 | General I/O port, SPI_CN, PWM3 |
2 | PD3 | General I/O port, PWM1_N, UART_TX |
3 | PD4 | General I/O port, SWM, PWM2_N |
4 | PD7 | Defined as UART_TX in the MESH firmware; requires external connection to RXD |
5 | PA0 | Defined as UART_RX in the MESH firmware; requires external connection to TXD |
6 | PA1 | General I/O port |
7 | PA7 | SWS module firmware download port 3.3V, SWS, GND – these three pins are sufficient for programming |
8 | PB1 | General I/O port, PWM4, UART_TX, SAR_ADC |
9 | 3.3V | Power supply |
10 | GND | Reliable grounding |
11 | PB4 | General I/O port, PWM5, SAR_ADC |
12 | PB5 | General I/O port, PWM5, SAR_ADC |
13 | NC | No Connection |
14 | NC | No Connection |
15 | PB6 | General I/O port, SPI_DI, UART_RTS, SAR_ADC |
16 | PB7 | Defined as AUX in the MESH firmware; used to indicate MESH status |
17 | PC0 | Defined as MODE in the MESH firmware; used to control MESH status |
18 | PC1 | General I/O port, I2C_SCK, PWM1_N, PWM0 |
19 | PC2 | Defined as SIG standard model output in the MESH firmware; it is recommended to route an LED for APP debugging and range testing during validation |
20 | PC3 | Defined as SIG standard model output in the MESH firmware; it is recommended to route an LED for APP debugging and range testing during validation |
21 | PC4 | General-purpose I/O, PWM2, UART_CTS, PWM0_N, SAR_ADC |
22 | RESET | Hardware reset; initializes the chip and enhances stability; active low |
Product size:
DL-TL-8250-A Value: The DL-TL8250-A Bluetooth module is a high-performance Bluetooth 5.0 SoC module developed by DreamLNK based on the TLSR8250F512 chip. It features BLE and SIG MESH capabilities, with a transmit power of 10 dBm and a sensitivity of up to -104 dBm @ 250 kbps. It delivers fast operation with an integrated 48 KB SRAM for high processing efficiency, and a low-power 32-bit processor running at 48 MHz with 512 KB of large-capacity Flash storage, making it well-suited for complex application scenarios. This Bluetooth module supports Bluetooth mesh networking and direct control via Tmall Genie. Devices communicate through a SIG Mesh multi-hop star topology using Bluetooth broadcasting, and the mesh network can be flexibly expanded to cover larger areas.
DreamLNK is a high-tech enterprise specializing in ISM band micropower wireless communication technology, providing different kinds of wireless modules and one-stop IoT solutions, including 433/868/915MHz wireless modules, 2.4G wireless Modules, FSK Transceiver Modules, LoRa Modules, BlE Modules, Antennas, Remote Controls, and customized wireless RF solutions. Welcome to inquire!
